Radiation Hardened Electronics Market

Radiation-hardened electronics refers to several electronic components, packages and products which are majorly used for high-altitude applications. The materials used for the production of such components such as silicon carbide, silicon, gallium nitride and hydrogenated amorphous silicon. These components can withstand the damage caused by ionizing and high-energy radiations, and gamma and neutron radiation emitted by nuclear reactors. They are highly used in satellites, aircraft and nuclear power plants in the form of switching regulators, microprocessors and power supply devices. Industries use radiation-hardened electronics to protect devices/systems from the effects of radiation. Rising intelligence, surveillance and reconnaissance (ISR) operations, huge demand for radiation-hardened electronics in the communication satellite segment, and surging demand for electronic systems which can withstand considerable radiation exposure in the nuclear power industry is projected to propel the growth of radiation-hardened electronics market. The key factor accelerating the radiation-hardened electronics market is the surging demand for power management devices. Another key factor augmenting the requirement for a radiation-hardened electronics market is the rising need for diodes, transistors in several industries, particularly in defense and space applications. In addition, technological advancements are leading to emphasize on the incorporation of radiation-hardened electronics chips into multiple devices, which is also projected to boost the market growth. Furthermore, the increase in the number of space missions, backed by the increase in demand for communication satellites is anticipated to fuel the growth of the radiation-hardened electronics market. Apart from this, the huge costs incurred in development and designing are likely to impede the market growth.

The ever-rising growth in internet accessibility around the world coupled with several technological advancements including 5G, blockchain, cloud services, Internet of Things (IoT), and Artificial Intelligence (AI) among others have majorly fueled the economic growth in the last two decades. In addition to this, the growth in ICT sector has vitally contributed towards GDP growth, labor productivity, and research and development spending among other transformations of economies in several nations of the world. Moreover, the production of goods and services in the ICT sector is also responsible for the economic growth and development.

The global Radiation-Hardened Electronics Market is segregated on the basis of Component Type as Analog & Digital Mixed Signal Devices, Memory, Controllers & Processors and Power Management Component. Based on Manufacturing Technique the global Radiation-Hardened Electronics Market is segmented in Rad-Hard by Design and Rad-Hard by Process. Based on Product Type the global Radiation-Hardened Electronics Market is segmented in Custom-made and Commercial-Off-The-Shelf (COTS). Based on Application the global Radiation-Hardened Electronics Market is segmented in Space, Aerospace & Defense, Nuclear Power Plants, Medical and Others.

The global Radiation-Hardened Electronics Market report provides geographic analysis covering regions, such as Europe, North America, Asia Pacific, and Rest of The World. The Radiation-Hardened Electronics Market for each region is further segmented for major countries including the U.S., Canada, Germany, the U.K., France, Italy, China, India, Japan, Brazil, South Africa, and others.

Competitive Analysis

Maxwell Technologies, Maxwell Technologies Inc., Maxwell Technologies, Inc., Microchip Technology Inc, Microchip Technology Inc. and others are among the major players in the global Radiation-Hardened Electronics Market. The companies studied in terms of product strategy and various n several growth and expansion strategies to gain a competitive edge in the market. The major players not only follow value chain integration with business operations in multiple stages of the value chain.

• In August 2020, BAE Systems declared the plan to extend its operations in Austin, Texas, by establishing a major campus in Parmer Austin Business Park. Work at the site will include new programs and existing business, which majorly comprises the development, designing, and manufacturing of radiofrequency and electro-optical/infrared countermeasure systems. The improved capacity will allow the company to continue to implement its commitments to customers while positioning it to meet the demand for key products within its Electronic Systems business.
• In June 2019, Microchip Technology through its Microsemi subsidiary, collaborated with STAR-Dundee to create an evaluation platform which implements SpaceFibre technology, which was recently accepted by the VITA Standards Organization (VSO) as an option of control-and-data plane for its SpaceVPX interconnect standard. As the first of its type to feature FPGAs which are resistant to radiation-induced configuration changes, the development board utilizes the distinct architecture of Microchip’s RTG4 devices to improve performance while offering systems with an additional crucial level of failure protection in the space.

The global Radiation-Hardened Electronics Market has been segmented as below:

Radiation-Hardened Electronics Market, By Component Type

• Analog & Digital Mixed Signal Devices
• Memory
• Controllers & Processors
• Power Management Component

Radiation-Hardened Electronics Market, By Manufacturing Technique

• Rad-Hard by Design
• Rad-Hard by Process

Radiation-Hardened Electronics Market, By Product Type

• Custom-made
• Commercial-Off-The-Shelf (COTS)

Radiation-Hardened Electronics Market, By Application

• Space
• Aerospace & Defense
• Nuclear Power Plants
• Medical
• Others

Radiation-Hardened Electronics Market, By Region

• Europe
• North America
• Asia Pacific
• Rest of The World

Radiation-Hardened Electronics Market, By Company

• Maxwell Technologies
• Maxwell Technologies Inc.
• Maxwell Technologies, Inc.
• Microchip Technology Inc
• Microchip Technology Inc.
• Micropac Industries, Inc
• Micropac Industries, Inc.
• Microsem
• pSemi
• 3D Plus
• 3D Plus SA
• Analog Devices Inc.
• Analog Devices, Inc
• Anaren Inc
• Anaren, Inc.
• BAE Systems
• Cobham Limited
• Cobham Plc

The report covers the below scope:

• Global Radiation-Hardened Electronics Market sizes from 2020 to 2026, along with CAGR for 2020-2026
• Market size comparison for 2019 vs 2026, with actual data for 2019, estimates for 2019 and forecast from 2020 to 2026
• Global Radiation-Hardened Electronics Market trends, covering comprehensive range of consumer trends & manufacturer trends
• Value chain analysis covering participants from raw material suppliers to the downstream buyer in the global Radiation-Hardened Electronics Market
• Major market opportunities and challenges in forecast timeframe to be focused
• Competitive landscape with analysis on competition pattern, portfolio comparisons, development trends and strategic management
• Comprehensive company profiles of the key industry players

The years considered for the study are as follows:

• Base year - 2019
• Estimated year - 2019
• Projected year - 2020
• Forecast period - 2021 to 2026

Report Scope:

The global Radiation-Hardened Electronics Market report scope includes detailed study covering underlying factors influencing the industry trends. The report covers analysis on regional and country level market dynamics. The scope also covers competitive overview providing company market shares along with company profiles for major revenue contributing companies. The report scope includes detailed competitive outlook covering market shares and profiles key participants in the global Radiation-Hardened Electronics Market share. Major industry players with significant revenue share include Maxwell Technologies, Maxwell Technologies Inc., Maxwell Technologies, Inc., Microchip Technology Inc, Microchip Technology Inc. and others.

Why to Buy this Report:

• Gain detailed insights on the Radiation-Hardened Electronics industry trends
• Find complete analysis on the market status
• Identify the Radiation-Hardened Electronics Market opportunities and growth segments
• Analyse competitive dynamics by evaluating business segments & product portfolios
• Facilitate strategy planning and industry dynamics to enhance decision making

Target Audience:

• The report targeted towards the existing players in the industry is as follows:
• Market Manufacturers/Service Providers
• Market Wholesale/Traders
• Investment and Financial Institutions

Free and Paid Customization based on the requirement

1.      Introduction

1.1.       Key Points

1.2.      Report Description

1.3.      Markets Covered

1.4.      Stakeholders

2.     Research Methodology

2.1.      Research Scope

2.2.     Research Methodology

2.2.1.     Market Research Process

2.2.2.    Research Methodology

2.2.2.1.           Secondary Research

2.2.2.2.          Primary Research

2.2.2.3.          Models for Estimation

2.3.     Market Size Estimation

2.3.1.     Bottom-Up Approach

2.3.2.    Top-Down Approach

3.     Executive Summary

4.    Market Overview

4.1.      Introduction

4.2.     Drivers

4.3.     Restraints

4.4.     Opportunities

4.5.     Challenges

5.     Radiation-Hardened Electronics Market, By Component Type

5.1.      Key Points

5.2.  Analog & Digital Mixed Signal Devices

5.3.  Memory

5.4.  Controllers & Processors

5.5.  Power Management Component

6.    Radiation-Hardened Electronics Market, By Manufacturing Technique

6.1.      Key Points

6.2. Rad-Hard by Design

6.3. Rad-Hard by Process

7.     Radiation-Hardened Electronics Market, By Product Type

7.1.      Key Points

7.2.  Custom-made

7.3.  Commercial-Off-The-Shelf (COTS)

8.    Radiation-Hardened Electronics Market, By Application

8.1.      Key Points

8.2. Space

8.3. Aerospace & Defense

8.4. Nuclear Power Plants

8.5. Medical

8.6. Others

9.    Competitive Landscape

9.1.      Introduction

9.2.     Start-up companies- Radiation-Hardened Electronics Market

9.3.     Recent Developments

9.3.1.     Mergers & Acquisitions

9.3.2.    New Product Developments

9.3.3.    Portfolio/Production Capacity Expansions

9.3.4.    Joint Ventures, Collaborations, Partnerships & Agreements

9.3.5.     Others

10.            Company Profile

10.1. Maxwell Technologies

10.2.    Maxwell Technologies Inc.

10.3.    Maxwell Technologies, Inc.

10.4.    Microchip Technology Inc

10.5.    Microchip Technology Inc.

10.6.    Micropac Industries, Inc

10.7.     Micropac Industries, Inc.

10.8.    Microsem

10.9.    pSemi

10.10.3D Plus

10.11.  3D Plus SA

10.12. Analog Devices Inc.

10.13. Analog Devices, Inc

10.14. Anaren Inc

10.15. Anaren, Inc.

10.16. BAE Systems

10.17. Cobham Limited

10.18.Cobham Plc